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变化四：新兴先进封测技术的兴起CoWoS先进封装可谓HBM的黄金搭档。随着全球对于高性能计算（HPC）及人工智能（AI）芯片需求的持续增长，也推动了对于台积电CoWoS（Chip on Wafer on Substrate）先进封装产能的需求暴涨，虽然台积电持续扩大产能，但依然难以满足市场需求，成为了限制HPC及AI芯片产能的另一关键瓶颈。这也使得部分客户考虑寻求台积电CoWoS以外的替代方案，其中就包括英特尔的EMIB-T先进封装技术。
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The Artemis III mission, which had been expected to land astronauts near the moon's south pole in 2028, now will be redefined and rescheduled — launching in 2027 but not to the moon, Isaacman said. Instead, the yet-to-be-named astronauts will rendezvous and dock in orbit closer to home with one or both of the commercially built lunar landers now under development at Elon Musk's SpaceX and Jeff Bezos' Blue Origin.，推荐阅读Line官方版本下载获取更多信息
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